PET high-temperature tape

Before using PET high-temperature tape, the base layer needs to be treated. There should be no floating ash, stains, or grease on the base layer. If the surface of the base layer is uneven, it will seriously affect the adhesion of the tape. Therefore, it is advisable to keep the surface of the base layer as flat and smooth as possible. 2. When using, flatten the tape and stick it to the area where it needs to be used. After pasting, use your hands to compact the surface and squeeze out the air under the tape to ensure a stable bonding. 3. The length and width of the tape have fixed specifications and dimensions. If the parts that need to be used are not suitable for resizing, use a knife to cut and correct them. Do not affect the adhesion effect due to the inappropriate size of the tape.
The use or purpose of polyimide tape (4) Application in microelectronic devices: Due to its outstanding high temperature resistance, dielectric and excellent radiation resistance, polyimide has been widely used as a functional material in the microelectronics industry, especially in large-scale and ultra large scale integrated circuits. Used as a dielectric layer for interlayer insulation, as a buffer layer, it can reduce stress and improve yield. As a protective layer, it can reduce the impact of the environment, especially radiation, on the device, and also act as a shielding effect on a particles, reducing or eliminating the soft error of the device. If 50-100 is coated on the passivation film of the component casing μ The coating of m can prevent soft errors in memory caused by radiation released from trace amounts of uranium and thorium. Coating a polyimide protective layer on microelectronic devices can effectively block electron migration, prevent device corrosion, and increase the device's moisture resistance. Coating polyimide on the surface of the chip as a buffer layer can effectively prevent collapse caused by thermal stress. In addition, due to its similar coefficient of linear expansion to copper, polyimide has strong adhesion to copper foil composite and can be used for flexible printed circuit boards. High temperature tape should not be used together with tapes of different varieties, specifications, strengths, and layers of fabric.